Preci-Dip 558-10-652M35-001104
- 558-10-652M35-001104
- Preci-Dip
- BGA SURFACE MOUNT 1.27MM
- Sockets for ICs, Transistors
- 558-10-652M35-001104 数据表
- -
- -
- 无铅/符合RoHS
- 22477
- 现货库存/授权经销商/工厂剩余库存
- 1年质量保障 》
- 点击获取费率
Part Number 558-10-652M35-001104 |
Category Sockets for ICs, Transistors |
Manufacturer Preci-Dip |
Description BGA SURFACE MOUNT 1.27MM |
Package - |
Series 558 |
Type BGA |
Features Closed Frame |
Operating Temperature -55°C ~ 125°C |
Mounting Type Surface Mount |
Termination Solder |
Housing Material FR4 Epoxy Glass |
Pitch - Mating 0.050" (1.27mm) |
Contact Finish - Mating Gold |
Contact Finish - Post Gold |
Contact Finish Thickness - Mating 10µin (0.25µm) |
Number of Positions or Pins (Grid) 652 (35 x 35) |
Contact Material - Mating Brass |
Pitch - Post 0.050" (1.27mm) |
Contact Finish Thickness - Post 10µin (0.25µm) |
Contact Material - Post Brass |
Package_case - |
558-10-652M35-001104 保障
• 响应及时
• 质量保证
• 全球通行
• 具有竞争力的价格
• 供应链一站式配套服务
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Preci-Dip
Preci-Dip - Preci-Dip packs unequaled expertise into cutting-edge interconnect components. Leveraging advanced designs, and top materials, with incomparable Swiss precision,Preci-Dip’s precision tools and contact assembly machines are developed, designed, and produced ...
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