Infineon Technologies FS770R08A6P2LBBPSA1
- FS770R08A6P2LBBPSA1
- Infineon Technologies
- HYBRID PACK DRIVE
- Transistors - IGBTs - Modules
- FS770R08A6P2LBBPSA1 数据表
- Module
- Tray
- 无铅/符合RoHS
- 2123
- 现货库存/授权经销商/工厂剩余库存
- 1年质量保障 》
- 点击获取费率
Part Number FS770R08A6P2LBBPSA1 |
Category Transistors - IGBTs - Modules |
Manufacturer Infineon Technologies |
Description HYBRID PACK DRIVE |
Package Tray |
Series HybridPACK™ |
Operating Temperature -40°C ~ 150°C (TJ) |
Mounting Type Chassis Mount |
Package / Case Module |
Supplier Device Package AG-HYBRIDD-1 |
Power - Max 654 W |
Configuration Three Phase Inverter |
Current - Collector (Ic) (Max) 450 A |
Voltage - Collector Emitter Breakdown (Max) 750 V |
Current - Collector Cutoff (Max) 1 mA |
IGBT Type Trench Field Stop |
Vce(on) (Max) @ Vge, Ic 1.35V @ 15V, 450A |
Input Capacitance (Cies) @ Vce 80 nF @ 50 V |
Input Standard |
NTC Thermistor Yes |
Package_case Module |
FS770R08A6P2LBBPSA1 保障
• 响应及时
• 质量保证
• 全球通行
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Infineon Technologies
Infineon Technologies is a leading global designer, manufacturer and supplier of a broad range of semiconductors used in various microelectronic applications. Infineon's product portfolio consists of logic products, including digital, mixed-signal, and analog ...
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