LPC2917FBD144/01/,

NXP USA Inc. LPC2917FBD144/01/,

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  • LPC2917FBD144/01/,
  • NXP USA Inc.
  • IC MCU 16/32B 512KB FLSH 144LQFP
  • Embedded - Microcontrollers
  • LPC2917FBD144/01/, 数据表
  • 144-LQFP
  • Tray
  • 无铅/符合RoHS无铅/符合RoHS
  • 24500
  • 现货库存/授权经销商/工厂剩余库存
  • 1年质量保障 》
  • 点击获取费率
Part Number
LPC2917FBD144/01/,
Category
Embedded - Microcontrollers
Manufacturer
NXP USA Inc.
Description
IC MCU 16/32B 512KB FLSH 144LQFP
Package
Tray
Series
LPC2900
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
144-LQFP
Supplier Device Package
144-LQFP (20x20)
Voltage - Supply (Vcc/Vdd)
1.71V ~ 3.6V
Speed
80MHz
Number of I/O
108
EEPROM Size
-
Core Processor
ARM9®
RAM Size
80K x 8
Core Size
16/32-Bit
Connectivity
CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals
POR, PWM, WDT
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Data Converters
A/D 16x10b
Oscillator Type
Internal
Package_case
144-LQFP

LPC2917FBD144/01/, 保障

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NXP USA Inc.
NXP USA Inc.
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is ...
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